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Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler

Categories Thermal Conductive Gel
Brand Name: Ziitek
Model Number: TIF090-11
Certification: UL
Place of Origin: China
MOQ: 1000tube
Price: 0.1-100USD/KG
Payment Terms: T/T
Supply Ability: 10000KG/MONTH
Delivery Time: 3-8 WORK DAYS
Packaging Details: 300cc/PCS,6PCS/Box
Products name: Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler
Application: Electronic Components
Color: Gray
Materail: Ceramic filled silicon material
Continuous use temp: -45-200 ℃
Thermal conductivity: 9.0W/m-K
keyword: Silicone Thermal Gel
Specific Gravity: 3.45 g/cc
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  • Company Profile

Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler

Good Thermal Conductive 9.0W Silicone Thermal Gel Silicone Putty Thermal Gap Filler


TIF®090-11 is a soft silicone-based gap filler pad formulated with thermally conductive fillers and a unique compound that combines excellent themal performance with outstanding softness. Compared to conventional thermal grease,TIF®090-11 has a higher viscosity, effectively preventing the separation of fllers from the siliconebase. lt also offers more stable bond line control under pressure,enhancing product reliability. TIF®090-11 is applied similaty to traditional themal paste and is compatible with various commercial equipment,such as dispensing systems or automated production equipment. lt is suitable for a wide range of high-power electronic components and packaging formats, including flip-chip microprocessors (Flip-Chip MPU),PPGA, micro BGA,BGA,DSP chips, circular accelerator chips, and LED lighting modules.


Feature
> Thermal conductivity: 9.0W/mK

> Soft, very low compression

> Low thermal inpedance

> Operate automaticly
> Proven long-term reliability


Application
> Heat-sink & frame
> LED backlight module,LED lighting

> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler

> Telecom industry
> Semiconductor automatic laboratory equipment

TIFTM090-11 Typical Property
PropertyValueTest method
ColorGrayVisual
Construction & CompositionCeramic filled silicon material*****
Viscosity13000K mPa.sGB/T 10247
Specific Gravity3.45g/cm³ASTM D297
Thermal conductivity9.0 W/mKASTM D5470
Thermal resistance @10Psi(℃-in²/W)0.089ASTM D5470
Thermal resistance @50Psi(℃-in²/W)0.055ASTM D5470
Recommended Operating temp-45~200℃ISO 22007-2
Dielectric breakdown strength(V/mm)≥4000ISO 22007-2
Bond line Thickness0.40******
D3-D10(Siloxane Content, ppm)<100GC-MS
Flame RatingV-0UL 94

Packing details

30 cc/pc, 98 pc/box;

300 cc/pc , 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.

Please contact us for confirming.

Company Profile


Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Q&A


Q: Are you trading company or manufacturer ?

A: We are manufacturer in China


Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.


Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

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