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Bulk RTV Silicone Potting Compound Flame Retardant Waterproofing Bonding

Categories Silicone Potting Compound
Brand Name: Hanast
Model Number: HN-8806AB
Certification: MSDS
Place of Origin: CHINA
MOQ: 1KG
Price: 4.2
Payment Terms: T/T
Supply Ability: 1000000KG
Delivery Time: 3-7 work days
Packaging Details: Plastic/Iron Drums
Product name: Silicone potting glue
Color: Black/White/Transparent color, can customized
Application: PCB/Battery/LED
Package: 5kgs/25kgs/200kgs/bag
Material: Silicone&Agent
Keywords: Waterproof Sealant
Viscosity: Excellent Viscosity
Certificate: MSDS RoHS UL
Feature: Low and high Temperature Resistance
Thermal conductivity: Customize
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Bulk RTV Silicone Potting Compound Flame Retardant Waterproofing Bonding

Two-Component Silicone Potting Compound Flame Retardant Insulation Black High Quality Resin for Circuit Board Power Module Battery Sensors Sealing Waterproofing Bonding

HN-8806 Two-Component Addition-Type Silicone Potting Rubber

Product Specification

Test ItemsTest StandardUnitsProduct test results
Part APart B
Before curing1Appearance------Grey, fluidWhite, fluid
2ViscosityGB/T10247-200825ºC, mPa·S4500~50004500~5000
3DensityGB/T 13354-9225ºC, g/cm³1.50±0.051.50±0.05
4Mixing Ratio (A : B)1:01Weight ratio100100
Volume ratio100100
5Operating timeMeasuredhr0.3-0.4
6Curing conditionMeasuredhr4^12 (25ºC,initial cure)
0.20 (80ºC)
After
Curing
7Appearance------Grey elastomer
8HardnessGB/T 531.1-2008Shore A50±5
9Thermal conductivityGB/T10297-1998w/m·k≥0.76
10ExpansivityGB/T20673-2006μm/(m,ºC)210
11Moisture AbsorptionGB/T 8810-200524h,25ºC, %0.01~0.02
12Volume resistivityGB/T 1692-92(DC500V),Ω · cm1.0×10¹⁵
13Dielectric intensityGB/T 1693-2007Kv/mm(25ºC)18^25
14Temperature ResistanceMeasuredºC-50~+250°c

Product Description
HN-8806 is a two-component addition-type silicone potting rubber that can be cured into a high-performance elastomer at room temperature or with heating. This potting silicone rubber offers excellent electrical insulation, high moisture resistance, and a wide operating temperature range of -50°C to 250°C. It is a low-viscosity potting compound suitable for deep-section curing, with low shrinkage after curing. It does not emit heat or by-products, is non-corrosive to filled and sealed components, and complies with RoHS standards. Its good thermal conductivity effectively transfers heat generated by electronic components.


Applications
Widely used for potting and sealing electronic components, such as various power modules, circuit boards, high-voltage transformers, battery packs, fast-charging adapters, LED outdoor drive power supplies, and other products. It provides flame retardancy, environmental pollution resistance, vibration resistance, circuit and component protection, waterproofing, and thermal conductivity, making it ideal for moisture-proof protection in LED lamps.


Application Method

1.When using, mix components A and B evenly, then weigh them according to the specified ratio. Thoroughly mix with a clean stirring device in a clean container before potting. Vacuum sealing can be applied after removing bubbles.

2.Clean the surface of the potting element. For large products, it is recommended to pot in stages and then cure at room temperature (4-12 hours) or by heating (80°C for 0.5 hours).

3.For automated potting production lines, to ensure accurate mixing ratios of A and B, vacuum each component separately to remove bubbles (foaming time is 5-10 minutes). Then, pump A and B to a static mixer in proportion using a metering pump, and pot after thorough mixing.

Packaging
10KG/Set (A 5kg + B 5kg)
20KG/Set (A 10kg + B 10kg)
50KG/Set (A 25kg + B 25kg)


Storage and Transportation
*This product is non-toxic and non-hazardous. Store in a cool, dry place at room temperature.*

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