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Categories | Dowsil Adhesive |
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Place of Origin: | USA |
Brand Name: | dowsil |
Model Number: | TC-5121C LV |
Price: | CN¥956.41/kilograms >=1 kilograms |
Classification: | Other Adhesives |
Main Raw Material: | Silicone |
Usage: | Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking |
Type: | thermal paste |
Specifications: | 1kg |
Color: | gray green |
Thermal Conductivity: | 2.8W/m-K |
Dielectric Strength: | 1.89kV/mm |
Thermal Resistance at 40 psi: | 0.09°C-cm2/W |
Viscosity: | 79Pa-sec |
NVC(Non Volatile Content): | 99.3% |
MOQ: | 1 |
Packaging Details: | 1 piece |
Delivery Time: | 5-8days |
Payment Terms: | T/T,L/C,D/A,D/P,Western Union,MoneyGram |
Supply Ability: | 1000Piece |
Certification: | TDS,SDS,Rohs |
Company Info. |
Shenzhen Huazhisheng New Material Technology Co., Ltd. |
Verified Supplier |
View Contact Details |
Product List |
Product Attributes
Dowsil TC-5121C LV is a one-part, non-curing, thermally conductive
compound that is greenish yellow in color and has a flowable
consistency. It is designed to provide efficient heat transfer and
is suitable for use in various mid to high-end PCB system
assemblies. The product is characterized by its low thermal
resistance and the ability to achieve thin bond line thicknesses
(BLTs).
Product Overview
Dowsil TC-5121C LV is a thermally conductive compound that serves
as an interface material for PCB system assemblies. It is
engineered to facilitate effective heat removal from electronic
components, ensuring optimal performance and reliability. The
compound's unique formulation helps reduce thermal resistance and
allows for thin bond line thicknesses, which are critical for
enhancing heat transfer efficiency. Its non-curing nature
eliminates the need for curing ovens, simplifying the application
process and reducing production time.
Special Product Attributes
One of the standout features of Dowsil TC-5121C LV is its optimized
polymer matrix, which helps reduce pump-out, ensuring long-term
stability and performance. The compound exhibits low thermal
resistance and high thermal conductivity, making it an excellent
choice for applications where efficient heat dissipation is
crucial. Additionally, it is resistant to minimal or intermittent
solvent exposure, although it is best to avoid such exposure to
maintain its properties. The product is designed to maintain a
positive heat sink seal, improving heat transfer from the device to
the heat sink or chassis.
Application Scenarios
Dowsil TC-5121C LV is suitable for use in a variety of mid to
high-end PCB system assemblies, particularly in consumer
electronics where compact and efficient designs are essential. It
is commonly used in applications such as power modules, LED
lighting, and automotive electronics, where effective thermal
management is critical. The compound's ability to achieve thin bond
line thicknesses makes it ideal for applications where space is
limited, and efficient heat transfer is required.
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