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Fully automatic solder paste printer with post-printing inspection function.

Categories SMT Solder Paste Printer
SPI System: Built-in 2D Inspection
Packaging Details: Wooden export crate with anti-static and moisture-proof packaging and shock-mounted precision instrument transport
Repeat Accuracy: ±15μm
Inspection Speed: under 3s per board
Max PCB Size: 510×460mm
Model Number: OK-SASPP
Brand Name: Okai Intelligent Technology Co., Ltd.
Camera Resolution: 5MP Industrial CMOS
Min PCB Size: 50×50mm
Detectable Defects: Bridging, insufficient, offset, smear
Certification: ISO 9001
Payment Terms: T/T
Power Supply: AC 220V 50/60Hz 3KW
Delivery Time: 7-15 working days after payment
Price: open to negotiation
Printer Model: OK-SP460-I
MOQ: 1 Set
Place of Origin: Guangdong, China
Supply Ability: 150 Sets per Month
Inspection Coverage: 100 percent post-print
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Fully automatic solder paste printer with post-printing inspection function.

OK-SP460-I 2D SPI Integrated Fully Automatic Solder Paste Printer

The OK-SP460-I combines high-precision solder paste printing with integrated 2D solder paste inspection in a single machine footprint. By verifying print quality immediately after each cycle, it provides closed-loop feedback for real-time process control, catching defects before they reach reflow — critical for zero-defect SMT manufacturing.

Key Features

  • Built-in 2D SPI: High-resolution industrial CMOS camera scans the entire PCB surface post-print, covering all paste deposits
  • Defect Detection: Automatically identifies bridging, insufficient paste volume, misalignment, smearing, and skipped apertures with visual alert and log
  • Closed-Loop Feedback: SPI results feed back to printer parameters, auto-triggering cleaning cycles or squeegee pressure adjustments based on defect type
  • SPC Dashboard: Built-in statistical process control tracks yield trends, CPK values, and defect Pareto charts for continuous improvement
  • Single Footprint: Integrated design eliminates separate SPI machine, saving 2-3 meters of line length versus traditional two-machine setup

Technical Specifications

ParameterValue
SPI SystemBuilt-in 2D Solder Paste Inspection
Camera Resolution5MP Industrial CMOS
Inspection Coverage100 percent post-print area
Inspection Speedunder 3s per board
Detectable DefectsBridging, insufficient paste, offset, smear
Max PCB Size510*460mm

Applications

Essential for automotive electronics (ISO 26262), medical device PCBs (ISO 13485), aerospace modules, and any application where post-reflow rework is impossible or cost-prohibitive. Recommended for lines targeting under 50 dppm defect rates.

Packaging and Shipping

Precision instrument-grade packaging with vibration-isolated mount in export wooden crate. Pre-shipment calibration report included. Shipping within 7-15 working days.

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