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Cnc Processed Silicon Dioxide Sputtering Target

cnc processed silicon dioxide sputtering target

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Total 4 products from cnc processed silicon dioxide sputtering target Manufactures & Suppliers
Quality CNC Processed Silicon Dioxide Sputtering Target Fine Grinding Surface for sale

Brand Name:ZCQ

Model Number:ZCQ

Place of Origin:China

Silicon Dioxide Sputtering Target With Fine Grinding Surface Processed By CNC Quartz glass SiO2 also called silica glass is a very important material for industry and research. Quartz glass, which has a low coefficient of thermal expansion similar to ...

Yantai ZK Optics Co., Ltd.
Verified Supplier

Beijing

Quality Titanium Target Silicon Sputtering Target Gr5 Gr7 Pvd Coating Machine For PVD Vacuum Coating Machine for sale

Brand Name:LHTi

Model Number:Titanium Target

Place of Origin:Baoji, Shaanxi, China

...Target Silicon Sputtering Target Gr5 Gr7 Pvd Coating Machine For PVD Vacuum Coating Machine The word "target" in "titanium sputtering target" comes from the common target materials in our daily life. In the sputtering deposition process, the coating material is bombarded by the electron beam or ion beam, just like the target is hit, so the material used in the sputtering process is called the "sputtering target

Baoji Lihua Nonferrous Metals Co., Ltd.
Verified Supplier

Shaanxi

Quality Silicon  Dioxide granule 0.5-3mm,1-3mm,2-4mm,3~5mm ;  Φ2x2mm ; Φ3x3mm;   Φ25 or customer requirement size (SiO2 granule) for sale

Brand Name:TK NANO

Model Number:0.5-3MM

Place of Origin:China

SiO2 granule 0.5-3mm 1-3mm 2-4mm or customization 99.99% Chemical name: SiO2 Boiling point: 2230℃ Purity: 4N Specification: 1-4mm, particle, target Molecular weight: 60.08 Appearance: white Melting point: 1700℃ Density: 2.2-2.7g/cm3 In 10-4Torr vacuum ...

Chongqing Newsin Technology Co., Ltd
Active Member

Chongqing

Quality Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment for sale

Brand Name:JXS

Place of Origin:China

...Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target...

Foshan Jinxinsheng Vacuum Equipment Co., Ltd.
Verified Supplier

Guangdong

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