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Titanium Target

Titanium Target

Country/Region china

Company Baoji Oruixuan Titanium Industry Co., Ltd

Categories Custom Titanium Parts

Update 2020-03-24 22:28:44

ICP License Issued by the Chinese Ministry

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Titanium products

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Titanium Target

Product name

Titanium and titanium alloy target

Material

TA1TA2TA3TC4(Ti6AL4V)GR1GR2GR3GR5( Ti6AL4V)

Standard

Titanium round target: Technical conditions: Comply with GB / T2695-1996, ASTMB348-97

Titanium plate target: Technical conditions: Comply with GB / T3621-94, ASTM B265-93

Specification

Round target: common specifications: 60/65/95/100 * 30/32/40 / 45mm

Board target: (8-25) mm * (150-300) mm * (1000-2500) mm

Tube target: 70mm * 7mm / 10mm

Surface

Turning light, thread can be added

Characteristic

Light weight, excellent corrosion resistance, corrosion resistance, high strength, good heat resistance, good ductility, non-toxicity, non-magnetic, excellent mechanical strength, etc.

Status

Annealed state (M) Hot-worked state (R) Cold-worked state (Y) (annealed, supersonic flaw detection available)

Application

For semiconductor separation devices, flat panel displays, storage electrode films, sputter coating, surface coating of workpieces, glass coating industry

Overview and material requirements of titanium targets

Purity

Purity is one of the main performance indicators of the target, because the purity of the target has a great influence on the performance of the film. However, in practical applications, the purity requirements of the target materials are also different. For example, with the rapid development of the microelectronics industry, the size of silicon wafers has grown from 6 ”, 8” to 12 ”, and the wiring width has been reduced from 0.5um to 0.25um, 0.18um, or even 0.13um. Previously, the target purity was 99.995%. Can meet the process requirements of 0.35umIC, and the preparation of 0.18um lines requires a target purity of 99.999% or even 99.9999%.

Impurity content

Impurities in the target solid and oxygen and water vapor in the pores are the main sources of pollution of the deposited film. Different applications of target materials have different requirements for different impurity contents. For example, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for the content of alkali metals and the content of ra


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