Sign In | Join Free | My tjskl.org.cn
China More Super Hard Products Co., Ltd . logo
More Super Hard Products Co., Ltd .
ICP Remarked Supplier
Home >

Electroformed Diamond Dicing Blade - Hub Type

More Super Hard Products Co., Ltd .

Electroformed Diamond Dicing Blade - Hub Type

Country/Region china

Company More Super Hard Products Co., Ltd .

Categories Diamond Cutting Blades

Update 2020-06-22 22:24:48

ICP License Issued by the Chinese Ministry

Contact Now

Electroformed Diamond Dicing Blade - Hub Type

Hub type electroforming nickel bonded dicing blade

Blade thickness: 0.015 mm to 0.3 mm

Applications: dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.

Send E-mailInquiry
AddThis Sharing Buttons
Share to FacebookFacebookShare to TwitterTwitterShare to LinkedInLinkedInShare to PinterestPinterestShare to ...AddThis
  • Cutting Tool Industry

    For Standard PCD & CBN Tool GrindingFor Indexable Inserts GrindingFor Round Tools Grinding(CNC)For Micro Drill Tools Grinding
  • Diamond Jewelry Industry

    Bruting WheelPolishing&Lapping Discs
  • Automotive Industry

    For Engine & TurbochagerFor Gear, Steering & Brake
  • Bearing Industry

  • Woodworking Industry

    For Carbide Circular Saw SharpeningFor Bandsaw SharpeningFor Chainsaw SharpeningFor Cut-off grindingFor Woodturning Bench Grinder
  • Thermal Spraying Industry

  • Glass Industry

    For Automotive GlassFor Architectural GlassFor Optical GlassFor Glass Cutting
  • Oil&GAS Industry

  • LED & Semiconductor Industry

    Wafer Dicing bladesBack Grinding wheelDiamond Band Saw Blades
  • Medical Industry

  • Aviation and Turbine Industry

  • Dressing Tools

    Stationary DresserRotary Dresser
  • Diamond & CBN Grinding Wheels

    Diamond Grinding WheelCBN Grinding Wheel
  • Honing Tools

  • End Surface Grinding

Product DetailsDrawing&SpecificationRelated ProductsInquiry
Product Details

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade.

Applications of electroformed diamond dicing blade

Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.

How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

Drawing&Specification
Exposure(m)380510640760890102011501270Grit Size
Kerf width(m)380-510510-640640-760760-890890-10201020-11501150-12701270-1400#5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16-2020*38020*510
21-2525*38025*51025*640
26-3030*38030*51030*64030*76030*89020*1020
31-3535*38035*51035*64035*76035*89035*1020
36-4040*38040*51040*64040*76040*89040*102040*1150
41-5050*38050*51050*64050*76050*89050*102050*1150
51-6060*51060*64060*76060*89060*102060*115060*1270
61-7070*64070*76070*89070*102070*115070*1270
71-8080*89080*102080*115080*1270
81-90

Product Tags:

describe metallic bonding

      
China Electroformed Diamond Dicing Blade - Hub Type

Electroformed Diamond Dicing Blade - Hub Type Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: More Super Hard Products Co., Ltd .
*Subject:
*Message:
Characters Remaining: (0/3000)