Diamond dicing blade is used for grooving ,cutting silicon,
compound semiconductors, glass and other materials in electronic
information industry. Diamond dicing blade is one of new products
developed .Our dicing blades include diamond hub dicing blade and
diamond hubless dicing blade.
Applications of electroformed diamond dicing blade
Scribing dicing silicon wafers, copper wafer and compound
semiconductor wafers such as GaAs and SiC.
How to selection of the correct types of dicing blades to cut
* Binder of resin bond (soft strength) dicing blade, scribing hard
and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer