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10*10mm2 Undoped Epigan On Sapphire Substrates For Gallium Nitride Devices

Categories GaN Wafer
Brand Name: PAM-XIAMEN
Place of Origin: China
MOQ: 1-10,000pcs
Price: By Case
Payment Terms: T/T
Supply Ability: 10,000 wafers/month
Delivery Time: 5-50 working days
Packaging Details: Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere
Item: PAM-T-GaN-10-U
product name: 10*10mm2 Undoped GaN/Sapphire Substrates
Conduction Type: N-type
Dimension: 10X10 mm
Thickness: 5 ±1 μm
other name: GaN Wafer
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    10*10mm2 Undoped Epigan On Sapphire Substrates For Gallium Nitride Devices

    10*10mm2 Undoped Epigan On Sapphire Substrates For Gallium Nitride Devices


    PAM-XIAMEN’s Template Products consist of crystalline layers of gallium nitride (GaN), aluminum nitride (AlN),aluminum gallium nitride (AlGaN)and indium gallium nitride (InGaN), which are deposited on sapphire substrates. PAM-XIAMEN’s Template Products enable 20-50% shorter epitaxy cycle times and higher quality epitaxial device layers, with better structural quality and higher thermal conductivity,which can improve devices in the cost, yield, and performance.


    PAM-XIAMEN’sGaN on sapphire templates are available in diameters from 2" up to 6",and consist of a thin layer of crystalline GaN grown on a sapphire substrate. Epi-ready templates now available..


    Here shows detail specification:

    10*10mm2 Undoped GaN/Sapphire Substrates

    ItemPAM-T-GaN-10-U
    Dimension10X10 mm
    Thickness5 ±1 μm
    Orientation of GaNC plane (0001) off angle toward A-axis 0.2 ±0.1°
    Orientation Flat of GaN(1-100) 0 ±0.2°, 16 ±1 mm
    Conduction TypeN-type
    Resistivity (300K)< 0.5 Ω·cm
    Carrier Concentration<5X1017CM-3
    Mobility~ 300cm2 / V·s
    Dislocation Density< 5x108cm-2(estimated by FWHMs of XRD)
    Structure5 ±1 μm GaN/~ 50 nm uGaN buffer layer/430 ±25 μm sapphire
    Orientation of SapphireC plane (0001) off angle toward M-axis 0.2 ±0.1°
    Orientation Flat of Sapphire(11-20) 0 ±0.2°, 16 ±1 mm
    Surface Roughness:Front side: Ra<0.5nm, epi-ready;
    Back side: etched or polished.
    Useable Area> 90% (edge and macro defects exclusion)
    Packageeach in single wafer container, under nitrogen atmosphere, packed in class 100 clean room

    10*10mm2 Undoped GaN/Sapphire Substrates

    FWHM and XRD report

    A test report is necessary to show the compliance between custom description and our final wafers data. We will test the wafer characerization by equipment before shipment, testing surface roughness by atomic force microscope, type by Roman spectra instrument, resistivity by non-contact resistivity testing equipment,micropipe density by polarizing microscope, orientation by X-ray Orientator etc. if the wafers meet the requirement, we will clean and pack them in 100 class clean room, if the wafers do not match the custom spec, we will take it off.


    Testing Project: FWHM and XRD project

    The half-height full width (FWHM) is an expression of the range of functions given by the difference between two extreme values of the independent variable equal to half of its maximum. In other words, it is the width of the spectral curve measured between those points on the Y-axis, which is half the maximum amplitude.


    Below is an example of FWHM and XRD of AlN template:

    FWHM and XRD of AlN template


    FWHM and XRD of AlN template


    Here we show experiment as an example:

    Experiment on GaN on sapphire:Optoelectronic Properties and Structural Characterization of GaN Thick Films on Different Substrates through Pulsed Laser Deposition:


    Experiment on GaN on sapphire:Optoelectronic Properties and Structural Characterization of GaN Thick Films on Different Substrates through Pulsed Laser Deposition:

    All GaN film samples were deposited on different substrates by PLD at 1000 ◦C in a nitrogen plasma ambient atmosphere. The chamber was pumped down to 10−6 Torr before the deposition process began, and N2 gas (with a purity of 99.999%) was introduced. The working pressure once the N2 plasma was injected was 1.13 × 10−4 Torr. A KrF excimer laser (λ = 248 nm, Lambda Physik, Fort Lauderdale, FL, USA) was employed as the ablation source and operated with a repetition rate of 1 Hz and a pulse energy of 60 mJ. The average growth rate of the GaN film was approximately 1 µm/h. The laser beam was incident on a rotating target at an angle of 45◦ . The GaN target was fabricated by HVPE and set at a fixed distance of 9 cm from the substrate before being rotated at 30 rpm during film deposition. In this case, ~4 µm-thick GaN films were grown on a GaN/sapphire template (sample A), sapphire (sample B), Si(111) (sample C), and Si(100) (sample D). For the GaN on sample A, a 2-µm GaN layer was firstly deposited on sapphire substrate by MOCVD. Scanning electron microscopy (SEM, S-3000H, Hitachi, Tokyo, Japan), transmission electron microcopy (TEM, H-600, Hitachi, Tokyo, Japan), atomic force microscopy (AFM, DI-3100, Veeco, New York, NY, USA), double-crystal X-ray diffraction (XRD, X’Pert PRO MRD, PANalytical, Almelo, The Netherlands), low-temperature photoluminescence (PL, Flouromax-3, Horiba, Tokyo, Japan), and Raman spectroscopy (Jobin Yvon, Horiba, Tokyo, Japan) were employed to explore the microstructure and optical properties of the GaN templates deposited on different substrates. The electrical properties of the GaN films were determined by Van der Pauw-Hall measurement under liquid nitrogen cooling at 77 K


    Figure 3 shows plane-view SEM pictures of GaN fifilms grown on various substrates. The surface morphologies show different features, as they are strongly dependent on the types of substrates used. The surface of GaN fifilms in samples A and B was mirror-like, indicating less of a lattice mismatch between GaN and sapphire (Figure 3a,b). The smooth surface might be due to the high kinetic energy needed by PLD for GaN precursor migration and diffusion on the substrates’ surface [28]. A rough GaNfifilm surface, meanwhile, was observed in sample C (Figure 3c). Sample D presented an incomplete

    island coalescence process with a hexagonal structure, as shown in Figure 3d. This result indicates that GaN fifilms on Si(100) have a hexagonal phase. The different GaN fifilm structure of the grains can be attributed to the different lattice structure of the Si substrate [29]. The surface morphology and roughness of the GaN fifilms grown on different substrates were carried out by AFM measurements with the scanning area of 10 × 10 µm2 , as shown in Figure 4.

    Figure 3. Scanning electron microscopy (SEM) surface image of GaN fifilms grown on different

    substrates: (a) GaN/sapphire template (sample A); (b) sapphire (sample B); (c) Si(111) (sample C)(d)sia(100)(sampleD)


    Conclusion: the GaN thick films grown on a GaN/sapphire template, sapphire, Si(111), and Si(100) by high-temperature PLD. The substrate effect on GaN crystalline growth quality, surface morphology, stress behavior, and interface property were studied, if you need more product information, please enquire us.

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