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Rogers RO3003 60mil 1.524mm High Frequency PCB DK3.0 RF PCB for Power Amplifiers and Antennas

Categories Rogers PCB
Brand Name: Bicheng
Model Number: BIC-040.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RO3003
Layer count: 2 layers
PCB thickness: 1.6mm
PCB size: 88 x 92mm=1PCS
Solder mask: NO
Silkscreen: Black
Copper weight: 0.5oz
Surface finish: immersion gold
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    Rogers RO3003 60mil 1.524mm High Frequency PCB DK3.0 RF PCB for Power Amplifiers and Antennas

    Rogers RO3003 60mil 1.524mm High Frequency PCB DK3.0 RF PCB for Power Amplifiers and Antennas


    Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.


    Typical applications:

    1) Automotive radar

    2) Cellular telecommunications systems

    3) Datalink on cable systems

    4) Direct broadcast satellites

    5) Global positioning satellite antennas

    6) Patch antenna for wireless communications

    7) Power amplifiers and antennas

    8) Power backplanes

    9) Remote meter readers


    PCB SIZE88 x 92mm=1PCS
    BOARD TYPEDouble sided PCB
    Number of Layers2 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsYES
    LAYER STACKUPcopper ------- 18um(0.5 oz)+plate TOP layer
    RO3003 1.524mm
    copper ------- 18um(0.5 oz) + plate BOT Layer
    TECHNOLOGY
    Minimum Trace and Space:5 mil / 5 mil
    Minimum / Maximum Holes:0.4 mm / 5.2 mm
    Number of Different Holes:7
    Number of Drill Holes:95
    Number of Milled Slots:0
    Number of Internal Cutouts:3
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:RO3003 1.524mm
    Final foil external:1oz
    Final foil internal:N/A
    Final height of PCB:1.6 mm ±10%
    PLATING AND COATING
    Surface FinishImmersion Gold
    Solder Mask Apply To:NO
    Solder Mask Color:NO
    Solder Mask Type:NO
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendTOP
    Colour of Component LegendBlack
    Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
    VIAPlated through hole(PTH), minimum size 0.4mm.
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.


    RO3003 Typical Value
    PropertyRO3003DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.0±0.04Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.001Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-3Zppm/℃10 GHz -50℃to 150℃IPC-TM-650 2.5.5.5
    Dimensional Stability0.06
    0.07
    X
    Y
    mm/mCOND AIPC-TM-650 2.2.4
    Volume Resistivity107MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity107COND AIPC 2.5.17.1
    Tensile Modulus930
    823
    X
    Y
    MPa23℃ASTM D 638
    Moisture Absorption0.04%D48/50IPC-TM-650 2.6.2.1
    Specific Heat0.9j/g/kCalculated
    Thermal Conductivity0.5W/M/K50℃ASTM D 5470
    Coefficient of Thermal Expansion
    (-55 to 288℃)
    17
    16
    25
    X
    Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
    Td500℃ TGAASTM D 3850
    Density2.1gm/cm323℃ASTM D 792
    Copper Peel Stength12.7Ib/in.1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes


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