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F4BK350 High Frequency PCB Board 7 * 18cm High Speed Design GSM Module 1.6MM

Categories High Frequency PCB
Brand Name: XCE
Model Number: XCEM
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin: China
MOQ: 1pcs
Price: negotiation
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Delivery Time: 5-10 days
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Material: F4B
Layer: 2
Color: /
Min line space: 4mil
Min line width: 4mil
Copper thickness: 1OZ
Board size: 70*180mm
Panel: 1
Surface: Immersion Silver
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    F4BK350 High Frequency PCB Board 7 * 18cm High Speed Design GSM Module 1.6MM

    F4BK350 High Frequency PCB High Speed Design Immersion Silver Surface GSM module 1.6MM


    Specification:

    High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

    High frequency materials are UL 94V-0 rated for active devices and high power RF designs.


    Specification:

    (1) F4BK350 mixed-compression PCB
    (2) 2L high frequency pcb
    (3) POS blind hole plate
    (4) Professional PCB Manufacturer with 10 years' experience


    Specification:


    Brand: XCE
    Model: XCEH
    Board size: 7*18cm
    Cu thickness: 35UM
    Material: F4B
    Min line space&width: 4Mil


    Advantage
    F4BK350 High Frequency PCB High Speed Design Immersion Silver Surface GSM module 1.6MM
    1.Sufficient high frequency material raw
    2. PCB Have the comprehensive quality control system
    3. PCB good price
    4. PCB quick turn delivery time from 48hours.
    5. PCB certification(ISO/UL E354810/RoHS)
    6. 12 years experience in exporting service
    7. PCB is no MOQ/MOV.
    8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting


    Parameter:


    PRODUCT’S DETAILS
    Raw MaterialF4B
    Layer Count2-Layer
    Board Thickness1.6mm
    Copper Thickness35UM
    Surface FinishImmerison Silver
    Solder Mask/
    Silkscreen/
    Min. Trace Width/Spacing0.075/0.075mm
    Min. Hole Size0.25mm
    Hole Wall Copper Thickness≥20μm
    Measurement60*159mm
    PackagingInner: Vacuum-packed in soft plastic bales
    Outer: Cardboard Cartons with double straps
    ApplicationCommunication,automobile,cell,computer,medical
    AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,
    Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
    BGA Soldering And Gold Finger Are Acceptable
    CertificationUL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE


    Reference - our production capability for rigid PCB:
    Layers: 1 to 28
    Board finished thickness: 0.2 to 7.0mm
    Materials: FR4,Rogers,Taconic
    Max. finished board size: 23 x 25 (580 x 900mm)
    Min. drilled hole size: 3mil (0.075mm)
    Min. line width: 3mil (0.075mm)
    Min. line spacing: 3mil (0.075mm)
    Surface finish/treatment : HASL/HASL lead free,HAL, Chemicaltin, chemical gold
    Immersion Silver/gold,OSP, gold plating
    Copper thickness: 0.5-7.0oZ
    Solder mask color: green/yellow/black/white/red/blue
    Copper thickness in hole: >25.0μm (>1mil)
    Inner packing: Vacuum packing/plastic bag
    Outer packing: Standard carton packing
    Shape tolerance: ±0.13
    Hole tolerance: PTH: ±0.076 NPTH: ±0.05
    Certificates: UL, ISO 9001, ISO 14001, SGS, RoHS
    Special requirements: buried and blind Vias + controlled impedance + BGA
    Profiling: Punching, routing, V-CUT, beveling
    Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products


    Parameter


    XCE PCB technical specifications
    MaterialF4B
    Layer No.2
    Min board thickness

    2 layer0.2mm

    4 layer0.4mm

    6 layer 0.6mm

    8 layer 0.8mm

    10 layer 1.0mm

    Max panel size508*610mm
    Board thickness toleranceT≥0.8mm±8%.,T<0.8mm±5%
    Wall hole copper thickness>0.025mm(1mil)
    Finished hole0.2mm-6.3mm
    Min line width4mil/4mil(0.1/0.1mm)
    Min bonding pad space0.1mm(4mil)
    PTH aperture tolerance±0.075mm(3mil)
    NPTH aperture tolerance±0.05mm(2mil)
    Hole site deviation±0.05mm(2mil)
    Profile tolerance±0.10mm(4mil)
    Board bend&warp≤0.7%
    Insulation resistance>1012Ωnormal
    Through-hole resistance<300Ωnormal
    Electric strength>1.3kv/mm
    Current breakdown10A
    Peel strength1.4N/mm
    Soldmask regidity>6H
    Thermal stress288℃20Sec
    Testing voltage50-300V
    Min buried blind via0.2mm(8mil)
    Outer copper thickness1oz-5oz
    Inner cooper thickness1/2 oz-4oz
    Aspect ratio8:1
    SMT min green oil width0.08mm
    Min green oil open window0.05mm
    Insulation layer thickless0.075mm-5mm
    Taphole aperture0.2mm-0.6mm
    Special technologyIndepedance,Blind buried via,thick gold,aluminum PCB
    Surface finish

    HASL,Lead free HASL,Immersion Gold, Immersion Tin,

    Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating


    Buy F4BK350 High Frequency PCB Board 7 * 18cm High Speed Design GSM Module 1.6MM at wholesale prices
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