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Low Loss Printed Circuit Board (PCB) on Core TU-883 and Prepreg TU-883P Compatible with FR-4 Processes

Categories Arlon PCB Board
Brand Name: Bicheng Technologies Limited
Model Number: BIC-508-V3.2
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD 9.99-99.99 per piece
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Delivery Time: 10 working days
Packaging Details: Vacuum
Number of Layers: 4
Glass Epoxy: TU-883
Final foil external:: 1.0oz
Final height of PCB:: 1.6mm ±0.16
Surface Finish: Immersion Gold (16.5%) 2 micoinch over 100 microinch nickel
Solder Mask Color:: Green
Colour of Component Legend: White
Test: 100% Electrical Test prior shipment
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    Low Loss Printed Circuit Board (PCB) on Core TU-883 and Prepreg TU-883P Compatible with FR-4 Processes

    Low Loss Printed Circuit Board (PCB) on Core TU-883 and Prepreg TU-883P

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    ThunderClad 2 ( TU-883 ) is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss, radio frequency and wireless applications. ThunderClad 2 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. ThunderClad 2 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.


    Applications

    Radio frequency

    Backplane, High performance computing

    Line cards, Storage

    Servers, Telecom, Base station, Office Routers



    Performance and Processing Advantages

    Excellent electrical properties

    Dielectric constant less than 4.0

    Dissipation factor less than 0.005

    Stable and flat Dk/Df performance over frequency and temperature

    Compatible with modified FR-4 processes

    Excellent moisture resistance and Lead Free reflow process compatible

    Improved z-axis thermal expansion

    Anti-CAF capability

    Excellent through-hole and soldering reliability

    Halogen Free


    Our PCB Capabilities (TU-883)

    PCB Material:High Temperature Resin
    Designation:TU-883
    Dielectric constant:3.60 at 1GHz
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
    PCB thickness:0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
    Technology:HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

    Appendix: Typical Properties of TU-883

    Typical ValuesTest ConditionSPEC
    Thermal
    Tg (DMA)220 °C
    Tg (TMA)170 °CE-2/105+desN/A
    Td (TGA)420 °C
    CTE z-axis α135 ppm/°CPre-Tg< 60 ppm/°C
    CTE z-axis α2240 ppm/°CPost-Tg< 300 ppm/°C
    CTE z-axis2.50%50 to 260°C< 3.0%
    Thermal Stress, Solder Float, 288°C> 60 secA> 10 sec
    T-260> 60 min> 30 min
    T-288> 60 minE-2/105+des> 15 min
    T-300> 60 min
    Flammability94V-0E-24/125+des94V-0
    Electrical
    Permittivity (RC63%)
    1GHz (SPC method)3.60
    5GHz (SPC method)3.58C-24/23/50N/A
    10GHz (SPC method)3.57
    Loss Tangent (RC63%)
    1GHz (SPC method)0.0030
    5GHz (SPC method)0.0037C-24/23/50N/A
    10GHz (SPC method)0.0046
    Volume Resistivity> 1010 MΩ•cmC-96/35/90> 106 MΩ•cm
    Surface Resistivity> 108 MΩC-96/35/90> 104 MΩ
    Electric Strength> 40 KV/mm-> 30 KV/mm
    Dielectric Breakdown Voltage> 50 KV-> 40 KV
    Mechanical
    Young’s Modulus
    Warp Direction28 GPaAN/A
    Fill Direction26 GPa
    Flexural Strength
    Lengthwise> 60,000 psiA> 60,000 psi
    Crosswise> 50,000 psiA> 50,000 psi
    Peel Strength, 1.0 oz. Cu foil4~6 lb/inA> 4 lb/in
    Water Absorption0.08%E-1/105+des+D-24/23< 0.8 %

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