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Multilayer High Frequency Taconic Pcb TLY Military Low DK Base

Categories Taconic PCB
Brand Name: XCE
Model Number: XCE Bh77
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin: China
MOQ: MOQ 1 Piece
Price: Negotiation
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
Delivery Time: 5-10 working days
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color: Blue
Material: PTFE Material
Layer: Multilayer
Board Size: 12*3cm
Copper Thinknes: 1 oz
Min Line Width: 4 mil
Min Line Space: 4mil
Surface Finish: Immersion Gold
Name: Taconic pcb
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    • Product Details
    • Company Profile

    Multilayer High Frequency Taconic Pcb TLY Military Low DK Base

    Multilayer High Frequency Taconic Pcb With TLY Military Grade Very Low DK Base Material Low Cost RF Laminate

    Quick Detail :
    1. Type : Pcb
    2. Material : PTFE
    3. Layer : Multilayer
    4. Products Size :12*3cm
    5. Permittivity : 3.5
    6. Surface finish : Immersion Gold

    Features:
    1. oven glass laminates are constructed with a woven matrix of fiber-glass fabric coated with PTFE that is more mechanically stable and has a more uniform dielectric constant than traditional non-woven products. The laminates are dimensionally stable, and exhibit virtually no moisture absorption during fabrication process.
    2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
    3. Multilayer pcb design ,the precision of the pcb improves much more better .
    4. Low dielectric : 2.5 dielectric conductivity much more precision .


    Parameter:


    ModelParameterthickness(mm)Permittivity(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO58800.254 0.508 0.7622.20 ± 0.02
    RO43500.254 0.508,0.8,1.5243.5
    RO40030.5083.38
    TACONICTLF-350.83.5
    TLA-60.254,0.8,1,1.5,2.65
    TLX-80.254,0.8,1,1.62.55
    RF-60A0.646.15
    TLY-50.254,0.508,0.82.2
    TLC-320.8,1.5,33.2
    TLA-350.83.2
    ARLONAD255C06099C1.52.55
    MCG0300CG0.83.7
    AD0300C0.83
    AD255C03099C0.82.55
    AD255C04099C12.55
    DLC22012.2


    Description :

    with aTg > 170º C

    Taconic Advanced Dielectric Division manufactures PTFE/woven glass base materials for microwave, RF and high speed digital applications. Applications include LNAs, LNBs, PCS/PCN antennas, GSM and UMTS antennas, power amplifiers, filters, passive components, automotive cruise control, aerospace guidance telemetry, phase array radar, etc.



    PrePreg Material
    It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.


    Benefits:

    • Taconic

      PTFE and fiberglass fabric are the base materials for almost everything Taconic produces. The benefits of PTFE coatings are proven:

      · Temperature and chemical resistance

      · High dielectric strength

      · Dimensional stability under heat and pressure

      · Low electrical losses

      · Low-friction/non-stick smooth surface

    • RF-35TC High TC, DK 3.5 base material

    • CER-10 High DK Material, easily fabricated

    • TRF-41, TRF-43,TRF-45 Low cost RF laminate with FR4 DK values

    • TSM family of materials provides a solution to the difficulty of manufacturing high layer count multilayer PCBs with PTFE cores. The low fiberglass content of the TSM family allows more predictable multilayer manufacturing vs. non-woven materials.


    Typical Applications:

    • Microwave & RF Laminates
      Applications: automotive, LED, mechanical, medical, military, multilayer, RF/microwave, thin core packaging & flexible interconnect

      Applications: aerospace, apparel, automotive, carpet/flooring, chemical processing, composites, food processing, lamination, packaging, paper, plastics, PVC welding, rubber processing, screen printing and textile

    Production Description :

    ParameterValue
    Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
    Water absorption−0.125 in < 0.10%
    Temperature index140 °C (284 °F)
    Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
    Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
    Rockwell hardness110 M scale
    Bond strength> 1,000 kg (2,200 lb)
    Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
    Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
    Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
    Izod impact strength - LW> 54 J/m (10 ft·lb/in)
    Izod impact strength - CW> 44 J/m (8 ft·lb/in)
    Compressive strength - flatwise> 415 MPa (60,200 psi)
    Dielectric breakdown (A)> 50 kV
    Dielectric breakdown (D48/50)> 50 kV
    Dielectric strength20 MV/m
    Relative permittivity (A)4.8
    Relative permittivity (D24/23)4.8
    Dissipation factor (A)0.017
    Dissipation factor (D24/23)0.018
    Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
    Glass transition temperatureCan vary, but is over 120 °C
    Young's modulus - LW3.5×106 psi (24 GPa)
    Young's modulus - CW3.0×106 psi (21 GPa)
    Coefficient of thermal expansion - x-axis1.4×10−5 K−1
    Coefficient of thermal expansion - y-axis1.2×10−5 K−1
    Coefficient of thermal expansion - z-axis7.0×10−5 K−1
    Poisson's ratio - LW0.136
    Poisson's ratio - CW0.118
    LW sound speed3602 m/s
    SW sound speed3369 m/s



    Competitive Advantage:
    1) With UL,ROHS,ISO,IPC
    2).Lead time:3-10 working days
    3)Competitive price best quality
    4).Rich 20 years experience in High Tg Multilayer PCB .


    What Information customer need to provide for quotation ?
    1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
    2. BOM list for PCB assembly.
    3. Send us your sample PCB or PCBA.
    4. OEM is acceptable.

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