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Subglobular Alumina Powder for High Thermal Conductive Material

Country/Region china
Company Henan Suntek International Co.,Ltd.
Categories High Alumina Refractory Brick
Telephone 86- 371- 65331060
ICP License Issued by the Chinese Ministry
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    Subglobular Alumina Powder for High Thermal Conductive Material

    SUBGLOBULAR ALUMINA POWDER FOR HIGH THERMAIL CONDUCTIVE MATERIAL

    This product is a subglobular alumina powder with green density, good dispersity and good interface compatibility with organic polymer material. It meets the requirement of high filler content. The particle size distribution is narrow and the product is with high purity, good heat conductivity and insulation. Besides the normal products, we also provide products subject to customers’ needs of average particle size covering from 1-3m 、5-7m、10-12m, and 20-25m high thermal conductivity spherical alumina.

    Applications:

    This product is mainly applied to high polymer materials of organic silicon-based and epoxy, and used in thermal conductive pad, heat conductive silicone grease, potting compound and electrical packaging. It also can be a substitution of the imported like products.

    Main Technical Parameters:

    Grade

    Technical Data

    SAC-A-10

    SAC-A-20

    SAC-A-30

    SAC-B-01

    SAC-B-02

    SAC-B-03

    Chemical

    Component

    SiO2 %

    0.15

    0.10

    0.05

    0.12

    0.10

    0.10

    Fe2O3%

    0.03

    0.03

    0.03

    0.05

    0.05

    0.04

    Na2O %

    0.05

    0.05

    0.04

    0.10

    0.10

    0.05

    Attached water % ≤

    0.05

    0.05

    0.05

    0.10

    0.10

    0.10

    Loss on ignition % ≤

    0.05

    0.05

    0.04

    0.05

    0.05

    0.05

    Physical

    Properities

    Average particle size

    (um)

    8-10

    15-22

    30-45

    1.8-2.0

    2.7-3.3

    7-9

    a-phase % ≥

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